Product Details:
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| Material: | Molybdenum Copper | Density: | 9.54 |
|---|---|---|---|
| CTE: | 11.5 | TC: | 230-270 |
| High Light: | copper base plate,copper block heat sink |
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High Thermal Conductivity Mo50Cu Moly/Copper Heat Sink Material
Description:
Mo-Cu heat sink material is a composite of molybdenum and copper,the Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
Advantages:
Good machinability
Good hermeticity
Good thermal conductivity
Good mechanical strength to provide excellent mechanical protection to the IC
Product Properties:
| Grade | Mo Content | Density g/cm3 |
Coefficient of thermal Expansion ×10-6 (20℃) |
Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.0 | 7 | 160(25℃)/156(100℃) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
These composite are widely used in applications such as IGBT modules,Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product picture:
